Cadence® Sigrity™ provides high-speed system designers with the most comprehensive, end-to-end, in-design interconnect modeling, signal and power integrity simulation for PCB and IC packages. Sigrity technology helps reduce design re-spins by detecting and addressing power-aware SI and power ripple due to signal switching.
The Cadence® AWR Design Environment® platform provides RF/microwave engineers with integrated high-frequency circuit (Microwave Office®), system (Visual System Simulator™ (VSS)), and electromagnetic (EM) simulation (AXIEM®/Analyst™) technologies and electronic design automation (EDA) to develop physically realizable electronics ready for manufacturing.
Cadence® Clarity™ 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. The Clarity 3D Solver lets you tackle the most complex electromagnetic (EM) challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning applications with gold-standard accuracy.
The Cadence® Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture that delivers up to 10X faster performance than legacy solutions without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and PCB implementation platforms. This enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.